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Electrical - An Introduction to Electronics System Packaging
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Total Videos :42
Mod-01 Lec-01 Introduction and Objectives of the course
00:51:43
Mod-01 Lec-02 Definition of a system and history of semiconductors
00:52:47
Mod-01 Lec-03 Products and levels of packaging
01:00:00
Mod-01 Lec-04 Packaging aspects of handheld products; Case studies in applications
00:57:03
Mod-01 Lec-05 Case Study (continued); Definition of PWB, summary and Questions for review
00:55:44
Mod-02 Lec-06 Basics of Semiconductor and Process flowchart; Video on Sand-to-Silicon
00:57:48
Mod-02 Lec-07 Wafer fabrication, inspection and testing
00:56:57
Mod-02 Lec-08 Wafer packaging; Packaging evolution; Chip connection choices
01:00:53
Mod-02 Lec-09 Wire bonding, TAB and flipchip-1
00:57:11
Mod-02 Lec-10 Wire bonding, TAB and flipchip-2; Tutorials
01:02:45
Mod-03 Lec-11 Why packaging? & Single chip packages or modules (SCM)
00:59:36
Mod-03 Lec-12 Commonly used packages and advanced packages; Materials in packages
00:59:21
Mod-03 Lec-13 Advances packages (cont),Thermal mismatch in packages,Current trends in packaging
00:58:48
Mod-03 Lec-14 Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps
00:59:13
Mod-04 Lec-15 Electrical Issues -- I; Resistive Parasitic
00:56:02
Mod-04 Lec-16 Electrical Issues -- II; Capacitive and Inductive Parasitic
00:58:45
Mod-04 Lec-17 Electrical Issues -- III; Layout guidelines and the Reflection problem
00:58:18
Mod-04 Lec-18 Electrical Issues -- IV; Interconnection
00:46:35
Mod-05 Lec-19 Quick Tutorial on packages; Benefits from CAD; Introduction to DFM, DFR & DFT
00:56:55
Mod-05 Lec-20 Components of a CAD package and its highlights
00:58:53
Mod-05 Lec-21 Design Flow considerations; Beginning a circuit design with schematic work
00:57:04
Mod-05 Lec-22 Demo and examples of layout and routing; Technology file generation from CAD;
01:01:54
Mod-06 Lec-23 Review of CAD output files for PCB fabrication; Photo plotting and mask generation
00:55:41
Mod-06 Lec-24 Process flow-chart; Vias; PWB substrates
01:00:32
Mod-06 Lec-25 Substrates continued; Video highlights; Surface preparation
00:58:13
Mod-06 Lec-26 Photoresist and application methods,UV exposure and developing
01:01:24
Mod-06 Lec-27 PWB etching; Resist stripping; Screen-printing technology
00:59:25
Mod-06 Lec-28 Through-hole manufacture process steps; Panel and pattern plating methods
00:58:50
Mod-06 Lec-29 Video highlights on manufacturing; Solder mask for PWBs; Multilayer PWBs
00:59:39
Mod-06 Lec-30 Microvia technology and Sequential build-up technology process flow for high-density
00:59:33
Mod-06 Lec-31 Conventional Vs HDI technologies; Flexible circuits; Tutorial session
01:04:15
Mod-07 Lec-32 SMD benefits; Design issues; Introduction to soldering
00:59:11
Mod-07 Lec-33 Reflow and Wave Soldering methods to attach SMDs
00:58:33
Mod-07 Lec-34 Solders; Wetting of solders; Flux and its properties; Defects in wave soldering
00:58:52
Mod-07 Lec-35 Vapour phase soldering, BGA soldering and Desoldering/Repair; SMT failures
00:56:49
Mod-07 Lec-36 SMT failure library and Tin Whiskers
00:58:34
Mod-07 Lec-37 Tin-lead and lead-free solders,Phase diagrams,Thermal profiles for reflow soldering
00:58:42
Mod-07 Lec-38 Lead-free solder considerations,green electronics,RoHS compli & e-waste recycling iss
01:01:27
Mod-08 Lec-39 Thermal Design considerations in systems packaging
01:03:47
Mod-09 Lec-40 Introduction to embedded passives; Need for embedded passives; Design Library
00:59:00
Mod-09 Lec-41 Embedded capacitors; Processes for embedding capacitors; Case study examples
01:00:17
Mod-10 Lec-42 Chapter-wise summary
00:58:02
Electrical - An Introduction to Electronics System Packaging
University:
IIT India
Total Videos :42
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Electrical - An Introduction to Electronics System Packaging
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First Video of Electrical - An Introduction to Electronics System Packaging
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Mod-01 Lec-01 Introduction and Objectives of the course
Time: 0.0037150382995605 Seconds